Keywords
Citation
(2005), "Henkel's lead-free solder paste exhibits exceptional humidity resistance", Soldering & Surface Mount Technology, Vol. 17 No. 2. https://doi.org/10.1108/ssmt.2005.21917bad.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
Henkel's lead-free solder paste exhibits exceptional humidity resistance
Henkel's lead-free solder paste exhibits exceptional humidity resistance
Keywords: Solder paste, Humidity
A lead-free solder paste offering outstanding resistance to humidity has been launched by the electronics group of Henkel. Multicore® LF318 is a halide- free, no-clean, pin-testable formulation that promises broad process windows for both printing and reflow. The product has been developed to appeal particularly to multinational manufacturers wishing to qualify a single solder paste that offers reliable, repeatable performance within the assembly environment, under any climatic conditions.
LF318 achieves a consistently high degree of coalescence upon reflow even after 72 h at 27°C and 80 per cent relative humidity, and in testing to IPC ANSI/J- STD-005 and JIS-Z-3284 standards displays excellent resistance to slump. The main benefits of specifying LF318 are evident during printing and assembly: low paste wastage – the result of superior tack life and an open time greater than 24 h – and resistance to component movement during high- speed placement, through its high initial tack force of 2 g/mm2.
Suitable for reflow in air or nitrogen, LF318 displays excellent solderability on a wide range of surface finishes, including Ni/Au, immersion Sn, immersion Ag and OSP copper. After reflow, only soft, non- stick, colourless residues remain, easing visual inspection and permitting reliable in-circuit testing without clogging test probes, even after many hundreds of tests following double reflow.
Multicore LF318 is classified ROL0 according to ANSI/J-STD-004, and available in lead-free alloys 96SC (SAC387) and 97SC (SAC305). For assembly processes that do not require the use of a lead-free solder paste but would benefit from similar humidity resistance advantages to those of LF318, a tin-lead version of the solder paste, Multicore MP218, is available with similar properties.
For further information visit the web site: www.henkel.com/electronics