Water-soluble solder paste cuts out waste

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Keywords

Citation

(2004), "Water-soluble solder paste cuts out waste", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cad.006

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


Water-soluble solder paste cuts out waste

Water-soluble solder paste cuts out waste

Keywords: Solder paste

Indium 6.2 is a halide-free water-soluble solder paste claimed to provide exceptional printing and an unprecedented stencil life, virtually eliminating waste. In addition, Indium 6.2 offers: wide humidity tolerance for consistent printing performance; sharp print definition to allow for fine pitch applications; extraordinary tack time and strength for consistent component holding power and high speed component placement operations, including the use of tall components; outstanding slump resistance to assure satisfactory performance for fine pitch applications; excellent wetting on a wide variety of surface finishes; and a wide reflow profile window.

According to Indium Corp’s Interconnect Materials Business Unit Director, Brian Craig: “Indium6.2 delivers great value by offering the potential for drastically reduced solder paste waste”. “This addresses one of the top requests from our marketplace”.

For further information contact: cgowans@indium.com