New DEK stencils enable multiple deposit heights in a single pass

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Citation

(2004), "New DEK stencils enable multiple deposit heights in a single pass", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cad.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


New DEK stencils enable multiple deposit heights in a single pass

New DEK stencils enable multiple deposit heights in a single pass

DEK’s latest additive stencil technology allows users to create deposits of several heights in a single pass, to increase throughput, reduce the number of process steps, and increase equipment utilisation. DEK’s solution to creating multiple deposit heights also enhances the lifetime of squeegee blades or the wipers of an enclosed printing head, as well as the stencil.

Additive stencil technology can be applied to either side of the stencil. Building up selected areas on the stencil surface allows the height of selected deposits to be increased by between 10 μm and 100 μm compared to the nominal height determined by the main stencil thickness. The stencil can be built up in any area, up to a maximum dimensions of 40×40 mm, to meet customer requirements.

DEK’s Additive Stencil technology is enabled by precision techniques that allow the stencil thickness to be increased by carefully controlled increments, in specific areas of the stencil. The technique also allows DEK stencil designers to smooth the edges of the enhanced areas, allowing metal squeegees or the wipers of an enclosed head such as the DEK ProFlow® transfer head to ride-on and ride-off easily. This extends the lifetime of the squeegee or wiper, as well as the stencil, and enhances process control and repeatability.

DEK’s new technology is suitable when more than one stencil would traditionally be used, or where volumes of paste need to vary, or even for different component placements such as edge connectors. Manufacturing tolerances are as follows: minimum distance between 2 deposits is ±0.5 mm; the maximum area is 40×40 mm; the thickness tolerance is ±0.012 and the deposit thickness is a maximum of 0.075 mm.

For further information visit our Web site: www.dek.com.