Keywords
Citation
(2004), "Soldertec Global announces winners of Lead-Free Solder Awards 2003", Soldering & Surface Mount Technology, Vol. 16 No. 2. https://doi.org/10.1108/ssmt.2004.21916bab.025
Publisher
:Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
Soldertec Global announces winners of Lead-Free Solder Awards 2003
Soldertec Global announces winners of Lead-Free Solder Awards 2003
Keywords: Soldertec, Lead-free soldering, Awards
As the July 2006 lead-free compliance deadline draws near this year's award selections have been designed to reflect the need for clear dissemination of information between the component and materials suppliers and the electronics assembly industry. This year there is a Consortium award, a Co-operation award and a service award.
The winners are:
HDP Users Group (HDPUG), Brian Smith (Celestica), Vivek Gupta (Intel), Thilo Sack (Celestica) and others.
Dr Ning-Cheng Lee (Indium Corporation), Dr Edwin Bradley (Motorola) and Dr Vahid Goudarzi (Motorola)
Dr Hector Steen (Henkel Technologies – Multicore)
The HDP Users Group has been selected to receive a Lead-free Solder Consortium Award in recognition of the group's key accomplishment in resolving issues leading to supply chain readiness for the launch of lead-free products. In particular, we acknowledge the work of Brian Smith for the General Purpose Lead-free Assembly System concept, Thilo Sack for his minimum peak temperature work, and Vivek Gupta for his work on component labelling.
The Lead-free Solder Co-operation Award recognises the spirit of co-operation between materials supplier, Indium Corporation, and end user, Motorola. Dr Ning-Cheng Lee, Dr Edwin Bradley and Dr Vahid Goudarzi have developed a robust lead-free assembly process that has been unveiled to the commercial world. Results from the many parts of the assembly process have been shared through the jointly developed Quickstart program.
The Lead-free Solder Service Award has been granted to Dr Hector Steen for his contribution to fundamental research and publications arising from collaborative lead-free projects over a 15 year period. The projects include 1991 UK DTI (Alloy selection), European BRITE program, INNOLOT (High stress/temperature applications) and EPSRC program looking at lead-free flip chip assembly.
For further information, visit the Web site: www.lead-free.org