Sounding out component defects

Citation

(2001), "Sounding out component defects", Soldering & Surface Mount Technology, Vol. 13 No. 3. https://doi.org/10.1108/ssmt.2001.21913cad.008

Sounding out component defects

Sounding out component defectsKeywords: Semiconductors, Assembly

The new SM2000 scanning acoustic microscope from Dage employs high frequency ultrasound to provide non-destructive viewing of the internal structure of packaged electronic components. Designed specifically with the needs of back-end semiconductor assemblers in mind, the equipment is particularly suited to applications such as the detection of delaminations, cracks and voids in plastic packages (see Plate 5).

A compact, competitively priced system, the SM2000 has been ergonomically designed for user-friendly operation. PC-based, it employs Windows 98 software interfaces for machine set-up and data acquisition. Data interpretation is quick and easy.

In operation, single or multiple parts are loaded into the 140mm x 140mm inspection area, where a high speed scanning system maximises data acquisition and therefore inspection through-put.

Plate 5 Dage SM2000 scanning acoustic microscope

Since final image resolution in acoustic microscopy depends upon transducer frequency, a range of transducers, including 25, 50 and 100MHz versions, is offered. For maximum flexibility, they can be changed without tools in less than two minutes.

For further information visit: www.dage-group.com