Keywords
Citation
(2001), "NPL. Praise from delegates attending NPL workshop "Encapsulation and Underfills", Soldering & Surface Mount Technology, Vol. 13 No. 3. https://doi.org/10.1108/ssmt.2001.21913cab.018
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
NPL. Praise from delegates attending NPL workshop "Encapsulation and Underfills"
NPL
Praise from delegates attending NPL workshop – "Encapsulation and Underfills"
Keyword: NPL
Attendees at the recent Encapsulation and Underfills Workshop, organised by The National Physical Laboratory, were given an extensive overview of the different technologies available and a valuable insight into new product developments.
Mike Butler of Dexter and Tony Winster of Emerson & Cuming provided an overview of the different chemistries that are available and discussed ways of selecting the best product for each particular application.
Jamie Maughan of Speedline-Cookson provided a valuable insight into the operation of dispensing equipment, including those of products that are new to the marketplace.
Stuart Morris of Sonix Europe demonstrated the power of scanning acoustical microscopy to non-destructively examine the integrity of both glob tops and underfills.
Paul Tomlins, course leader from NPL, described new methods for measuring the surface insulation properties of glob tops and conformal coatings obtained over a short period of time, over a range of different temperatures and humidities, also assessing the strength of the adhesive bond formed with the underlying substrates.
This was one of the regular series of workshops organised by NPL.
For more information on all NPL events please contact: Deborah Lea. Tel: +44 (0) 20 8943 6065; Fax: +44(0) 20 8614 0429; E-mail: sstc@npl.co.uk