Keywords
Citation
(2001), "Qualitek introduces Delta 691 no-clean solder paste", Soldering & Surface Mount Technology, Vol. 13 No. 2. https://doi.org/10.1108/ssmt.2001.21913bad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Qualitek introduces Delta 691 no-clean solder paste
Qualitek introduces Delta 691 no-clean solder paste
Keywords: Qualitek, Solder pastes
691 no-clean solder paste incorporates a combination of improved hot slump resistant material along with a new activator blend, which eliminates mid chip beading and micro solder balling. High print speed up to 8 in/sec. More than eight hours of stencil life.
Suitable for pin in paste application. 691 is 100 percent ICT pin probable, and will reflow with or without nitrogen. Compatible with lead free process. Compatible with enclosed print head system, DEK Proflow, Rheo Pump and Cross Flow.
Further details: Tel: +1 630 628 8083; Fax: +1 630 628 6543; E-mail: solder@qualitek.com