SMART Group. Japan lead-free mission

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2001

41

Keywords

Citation

(2001), "SMART Group. Japan lead-free mission", Soldering & Surface Mount Technology, Vol. 13 No. 2. https://doi.org/10.1108/ssmt.2001.21913bab.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2001, MCB UP Limited


SMART Group. Japan lead-free mission

SMART Group

Japan lead-free mission

Keywords: SMART Group, Japan, Lead-free solder

The SMART Group recently embarked upon an outward trade mission to Japan to establish the current use of lead-free solders in electronic products. The trip was supported by the DTI as part of their International Technology Mission program. DTI missions are designed to improve the competitiveness of UK industry by fully disseminating the information gained during a tour, with industry seminars and a report.

The mission started with a seminar given by members of the SMART Group to invited guests from the Japanese electronics industry, including suppliers and manufacturing companies.

The industry team members were:

Nick Jolly – DTI;Rob Horsley – Celestica;Malcolm Warick – Loctite/Multicore;Phil Fulker – Invicta Engineering;Bob Willis – SMART Group.

Related articles