BGA reballing preforms now with lead-free spheres

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000




(2000), "BGA reballing preforms now with lead-free spheres", Soldering & Surface Mount Technology, Vol. 12 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

BGA reballing preforms now with lead-free spheres

Keywords Intertronics, Lead-free soldering, Ball grid array

Intertronics has announced the introduction of lead-free solder spheres on SolderQuik BGA preforms in response to approaching regulations which ban the use of lead in the electronics manufacturing process. The new variant is an addition to the existing SolderQuik range with tin-lead balls.

SolderQuik BGA preforms with lead-free solder (Sn90/Ag04) spheres are available in 0.020in., 0.025in., and 0.030in. ball diameters, with plans to introduce more options later this year. The ball attach process using the lead-free preform is the same as tin-lead, but the temperature profile is approximately 38°C higher.

SolderQuik BGA preforms are an easy and cost effective way to attach solder spheres to BGA components. An array of solder spheres which mirrors the array on the BGA is embedded in a water-soluble paper/polymer carrier. Flux is applied to the component and it is placed on top of the preform, using an inexpensive fixture for alignment. After reflow, the paper is moistened and peeled off. The entire process takes a few seconds and requires minimal operator skill or training.

SolderQuik BGA pretorm eliminates the need for stencils, loose solder balls or expensive tooling. Preforms are currently available in over 300 array patterns.

Full details are available from Intertronics on: +44 (0) 1865 842842 or visit:

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