SMTA International 2000 conference program

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000




(2000), "SMTA International 2000 conference program", Soldering & Surface Mount Technology, Vol. 12 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

SMTA International 2000 conference program

Keywords SMTA, Conferences

The SMTA International Technical Committee has released the final conference program for SMTA International. The outstanding program breaks new ground with a variety of new offerings. The conference will be held 24-28 September in Chicago, Illinois, at the Rosemont Convention Center.

Business Management and MEMs (Micro Electromechanical Systems) are two new symposia that will join the already popular Contract Manufacturing and Chip Scale Packaging symposia. Over 100 papers will be presented and technical sessions will focus on BGAs, flip chip, printing, DFM, dispensing, mass soldering, interconnect technologies, odd component assembly, lead-free issues, HDI, surface finishes, substrates, test, process control, and inspection. In addition, 15 international papers will be presented.

New courses for SMTA International 2000 include Lead-free soldering, Solder flux choices, Practical DOE for SMT/FPT/TH/FC and Electronics manufacturing, Chip and wire assembly for RF, Microwave and millimeter wave applications; Non-conductive polymer adhesives, Encapsulants and underfills for electronics; Troubleshooting the soldering process, Implementing the make-buy decision, Marketing and business in Asia, and more. All speakers are leading experts in their respective fields.

For more information about attending or exhibiting at SMTA International, contact the SMTA at +1 952-920-7682,, or visit the SMTA Web site at

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