Excellon automation announces first depanelization line

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000

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Keywords

Citation

(2000), "Excellon automation announces first depanelization line", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aad.001

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Excellon automation announces first depanelization line

Excellon automation announces first depanelization line

Keywords: Excellon, Printed circuit boards

Excellon announces the development of its first system for the Excellon depanellization line of equipment. The Excellon model 105DP is an in-line, fully automated depanellization router for populated boards. Excellon stated that the system maintains the "rock hard" stability, reliability, and accuracy for which the Excellon systems have long been known, while giving the user a completely hands-off operation for in-line applications.

The system receives a populated PCB panel, places it on the worktable, depanellizes the individual PC assemblies, then transfers the individual assemblies to standard or customized output conveyor systems. The head is able to rotate 90 or 180 degrees for off-loading routed circuits in any orientation. The system is designed to interface with conveyor systems, and provides a stable platform for vibration and dust free routeing of assembled boards. It is designed to provide reliable in-line depanellization for high volume assembly operations.

For further information, please contact: Michael T. McCraley; Tel: 310 534 6462.

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