Keywords
Citation
(1999), "MYDATA releases two new placement machines - MY9 and MY12", Soldering & Surface Mount Technology, Vol. 11 No. 3. https://doi.org/10.1108/ssmt.1999.21911cad.009
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
MYDATA releases two new placement machines - MY9 and MY12
MYDATA releases two new placement machines MY9 and MY12
Keywords MYDATA, Placement
This new family of machines was built with future technologies in mind by supplying a solid stable platform for accuracy. Both these machines are ideal for customers requiring the flexibility for short production runs.
MY12 was designed as a platform for high accuracy. It can handle 160 8mm feeders or 150 SOIC tubes or 128 8mm tapes and 32 JEDEC trays with the optional MYDATA Tray Exchanger (TEX™). When the optional HYDRA Speedmount® is added, it increases the placements rates from 6,500 up to 14,400 components per hour. The machine is then capable of performing both high-speed mounting and fine pitch placement with components ranging from QFP to chip scale BGA and CSP. The MY12 is designed to be the ideal all-round placement machine.
MY9 has the smallest footprint of the MY-series machines. It is designed with the same platform as the other machines in its family and it can handle up to 112 8mm feeders or 105 SOIC tubes or 80 8mm tapes and 32 JEDEC trays with the optional MYDATA Tray Exchanger (TEX™). With the newly released optional MYDATA® Dual Vision System (DVS), the machine is capable of placing QFPs, BGAs, and more advanced package technologies like flip chip, chip scale BGA and CSPs with pitch down to 0.16mm (6mil). The machine's small footprint and ability to place complex components makes it the perfect choice as a time pitch placer at the end of a chip-shooter line.