High thermally conductive adhesive for high power devices

Citation

(1999), "High thermally conductive adhesive for high power devices", Soldering & Surface Mount Technology, Vol. 11 No. 1. https://doi.org/10.1108/ssmt.1999.21911aad.005

High thermally conductive adhesive for high power devices

High thermally conductive adhesive for high power devices

Keywords Ablestik, Adhesives

Ablestik (http://www.ablestik.com) (Plate 1) has introduced a new high thermal conductivity adhesive, THERMAXX™ 2600K. For high power devices, this technology advancement offers ultra high thermal conductivity (approaching 20 W/m°K) which is eight to ten times higher than ordinary conductive epoxy adhesives. These superior features make the 2600K a potential replacement for soft solder or eutectic die attach at a significant cost saving.

This patented technology uses solid thermoplastic and/or thermoset polymer particles suspended in a solvent instead of dissolved in a diluent. This approach allows faster cure cycles and higher thermal conductivity after cure.

Thermaxx 2600K adhesive is a drop in replacement on standard die attach equipment and is packaged frozen in ready-to-use syringes. On the assembly line, 2600K adhesive is suitable for high speed dispensing and has a 24 hour work life.

For a copy of the Thermaxx 2600K technical package, contact Ablestik, 20021 Susana Road, Rancho Dominguez, CA 90221, USA. Tel: +1 (310) 764-4600; Fax: +1 (310) 764-2545; E-mail jilla.senkbeil@nstarch.com.

Plate 1 Thermaxx 2600K adhesive from Ablestik