Selective disassembly sequence optimization based on the improved immune algorithm
Robotic Intelligence and Automation
ISSN: 2754-6969
Article publication date: 23 March 2023
Issue publication date: 23 May 2023
Abstract
Purpose
The purpose of this paper is to improve the automation of selective disassembly sequence planning (SDSP) and generate the optimal or near-optimal disassembly sequences.
Design/methodology/approach
The disassembly constraints is automatically extracted from the computer-aided design (CAD) model of products and represented as disassembly constraint matrices for DSP. A new disassembly planning model is built for computing the optimal disassembly sequences. The immune algorithm (IA) is improved for finding the optimal or near-optimal disassembly sequences.
Findings
The workload for recognizing disassembly constraints is avoided for DSP. The disassembly constraints are useful for generating feasible and optimal solutions. The improved IA has the better performance than the genetic algorithm, IA and particle swarm optimization for DSP.
Research limitations/implications
All parts must have rigid bodies, flexible and soft parts are not considered. After the global coordinate system is given, every part is disassembled along one of the six disassembly directions –X, +X, –Y, +Y, –Z and +Z. All connections between the parts can be removed, and all parts can be disassembled.
Originality/value
The disassembly constraints are extracted from CAD model of products, which improves the automation of DSP. The disassembly model is useful for reducing the computation of generating the feasible and optimal disassembly sequences. The improved IA converges to the optimal disassembly sequence quickly.
Keywords
Acknowledgements
This work was supported by Huaneng Group Headquarters Technology Project (Grant No. HNKJ20–H88) and National Key R&D Program of China (Grant No. 2018YFB1501304).
Citation
Ji, J. and Wang, Y. (2023), "Selective disassembly sequence optimization based on the improved immune algorithm", Robotic Intelligence and Automation, Vol. 43 No. 2, pp. 96-108. https://doi.org/10.1108/RIA-06-2022-0156
Publisher
:Emerald Publishing Limited
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