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Emerald Group Publishing Limited
Copyright © 2012, Emerald Group Publishing Limited
Flexibilized, thermally conductive one part B-stage epoxy resists high temperatures
Article Type: New products From: Pigment & Resin Technology, Volume 41, Issue 6
Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties.
Serviceable over the wide temperature range of −80°F to +500°F, EP36AO provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 V/mil, a volume resistivity of 2-3×1012 ohm-cm and thermal conductivity of 9-10 BTU · in/ft2 · h · °F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in×10-6/°C at 60°C and a tensile strength of over 2,000 psi. EP36AO is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.
As a one component system, EP36AO does not require any mixing and offers the convenience of flexible cure schedules. A typical gel time is 30 min at 180°F, with full cures attained in 2-2.5 h at 300°F. This can be shortened further at higher temperatures. EP36AO will retain its liquidity as long as the temperature does not exceed 180°F. It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container. EP36AO is available in pints, quarts, gallons and five gallon containers. It is now also available in conveniently prepared 30 g cookies.