Qualcomm and TSMC collaborating on 28 nm process technology

Citation

(2010), "Qualcomm and TSMC collaborating on 28 nm process technology", Microelectronics International, Vol. 27 No. 2. https://doi.org/10.1108/mi.2010.21827bab.001

Qualcomm and TSMC collaborating on 28 nm process technology

Article Type: Industry news From: Microelectronics International, Volume 27, Issue 2

Qualcomm incorporated is working closely with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on 28 nm process technology. The advanced process node enables more features to be integrated into smaller chips with a high level of cost efficiency, accelerating the expansion of wireless into new market segments.

Small form factor and low power consumption are important features of Qualcomm’s next generation of system-on-a-chip solutions, including the Snapdragon™ chipset platform. The two companies are capitalising on their long-term relationship as Qualcomm works on migrating directly from 45 to 28 nm node.

Qualcomm and TSMC worked closely on 65 and 45 nm technologies. They are continuing their relationship into low power, low leakage 28 nm designs for high volume manufacturing. Delivering up to twice the density of previous manufacturing nodes, 28 nm technology allows semiconductors that power mobile devices to do far more with less power. Qualcomm and TSMC are working on both high-k metal gate 28HP and silicon oxynitride 28LP technologies. Qualcomm expects to tape out its first commercial 28 nm products in mid-2010.

Close collaboration with strategic technology and foundry partners is a key part of Qualcomm’s integrated fabless manufacturing business model, which delivers greater efficiencies and accelerated technology advancement to the industry.