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Emerald Group Publishing Limited
Copyright © 2010, Emerald Group Publishing Limited
Galaxy Thin Wafer System from DEK enhances process capability for HVM Thinned wafer applications
Article Type: New products From: Microelectronics International, Volume 27, Issue 1
Building on its highly successful Galaxy imaging platform, DEK has used the foundation of the technology's supreme accuracy and precision to develop a system specifically for processing thinned silicon wafers. The new Galaxy Thin Wafer System offers exceptional stability, enhanced process capability of Cp>2 at ±12.5 μm and advanced speed and acceleration control to ensure robust processing of today's delicate wafer products.
Central to the outstanding process capability of the Galaxy Thin Wafer System is an expertly engineered wafer pallet that delivers the support and stability required to properly secure wafers as thin as 75 μm during transport and processing. Approximately, 400 mm2, the DEK wafer pallet is flat to less than 10 μm and can accommodate wafers as large as 300 mm. The careful selection and use of porous materials ensures that thinned wafers can be held securely while being successfully processed with any one of today's most sophisticated packaging techniques, including DirEKt Ball Placement(tm), DirEKt Coat(tm) wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. The new pallet technology also delivers versatility, as it is capable of supporting wafers of varying sizes and thicknesses.
With a robust rail system and precision transport technology, the Galaxy Thin Wafer System provides the support and movement control required to accommodate transfer of the wafer-loaded pallet into and out of the mass imaging platform. The system's toothed, flat belts are driven by a servomotor and supply the large contact area critical for support and stability of the wafer pallet, offering unmatched control of its speed, acceleration and positioning.
On board the Galaxy Thin Wafer System, DEK's award-winning DirEKt Coat(tm) process for deposition of 25 μm thick die attach adhesives and other coatings now boasts a process capability of Cp>2 at ±12.5 μm and a total thickness variation as low as 7 μm on 150 μm thin wafers as large as 200 mm in diameter. Additional process extension afforded by the new system includes high first-pass yield ball placement of 200 μm spheres at 3,000 μm pitch, precision thermal interface materials deposition and wafer bumping, among others.
As the key development platform for the progression of advanced semiconductor applications, the roadmap for the Galaxy Thin Wafer System is ambitious, but not outside of the scope of DEK's innovative technology expertise. Repeatable 50 μm wafer imaging, high-yield sub-100 μm sphere placement, innovative use of alignment algorithms and vision systems that will provide the ability to align wafers with no unique fiducial marks are all current priorities.
For further information, please visit the web site: www.dek.com