Master Bond Polymer System EP41S-4

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2005




(2005), "Master Bond Polymer System EP41S-4", Microelectronics International, Vol. 22 No. 1.



Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

Master Bond Polymer System EP41S-4

Master Bond Polymer System EP41S-4

Keywords: Polymers, Epoxy resins

Two component, fast curing epoxy system for high security potting and encapsulation. Also for bonding, coating and sealing featuring outstanding resistance to acids, chlorinated solvents and alcohols.

Master Bond Polymer System EP41S-4 is a two component fast curing epoxy resin system specially designed for high security potting and encapsulating applications. Additionally, it is well suited for bonding, sealing and coating applications where resistance to chlorinated solvents, acids, alcohols and fuels is required. Master Bond EP41S-4 is 100 per cent reactive and does not contain any solvents or diluents. It bonds well to a variety of substrates developing a high bonding strength of more than 2,000 psi. Temperature range is from -60 to 300°F. It is available in black for high security potting and encapsulation as well as clear for bonding, sealing and coating. EP41S-4 has good thermal cyclability and abrasion resistance. The low viscosity of EP41S-4 is ideal for potting as well as coating applications. Additionally, EP41S-4 has exceptionally low shrinkage. This system is widely used in electronics/electrical and chemical processing.

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