Keywords
Citation
(2003), "Sikama International Inc. introduces new wafer transport system", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820cad.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Sikama International Inc. introduces new wafer transport system
Sikama International Inc. introduces new wafer transport system
Keywords: Silicon wafers
Sikama International has developed a new transport system ideally suited for transporting silicon wafers on their Falcon reflow systems. The new design uses flat "rods" that move horizontally and vertically through the furnace, gently lifting and advancing the wafers through the oven. Once the advancing is completed, the "rods" rotate and retract below the wafer to the home position, ready to begin the next cycle.
The new system replaces the sweeperbar design used previously in the tool (although still available for other applications). By lifting the wafer as it is advanced, temperature gradients across the wafer surface are even further reduced because the entire wafer is placed on the heat stage at the same time. There is no time when the wafer is straddling two zones with two different temperatures. Additional benefits include elimination of wafer breakage caused by sweeperbars, and improved flux management.
For more information, contact: Sikama International.