New laser trimming system from ESI

Citation

(2003), "New laser trimming system from ESI", Microelectronics International, Vol. 20 No. 3. https://doi.org/10.1108/mi.2003.21820cad.002

New laser trimming system from ESI

New laser trimming system from ESI

Keywords: Lasers, Thin films

The 2100 system from ESI represents a totally new approach to thin film laser trimming by building in prober and tester independence. ESI's patented 1.3 micron wavelength laser process ensures that it is capable of delivering the highest production output. Fully automatic, the 2100 uses industry standard tools for advanced linear, mixed signal and sensor trimming requirements (Plate 1).

Plate 1 The 2100 system from ESI

The 1.3 μm laser process reduces or eliminates laser induced optoelectric response and improves the "trimability" of most materials. The reduced optoelectric effects increase system throughput and allows trimming to tighter tolerances without compromise, potentially resulting in a 50 per cent reduction of total trim/test times in active applications.

The flexibility of this system allows the user to select the prober and tester of their choice for process optimisation. This approach enables access to the technology enhancements of each component within the trimming solution: laser processing, probing and testing.

The user interface software is based around Windows NT™ platform and offers intuitive and easy to use set-up and run-time programs that are designed and supported for maximum yield.

The 2100 laser trim system will integrate with most popular wafer probe systems and will interface with a wide variety of testers.

For more information, visit our Web site: www.esi.com