“Top 10 developments” in ceramic interconnect technology

Citation

(2003), "“Top 10 developments” in ceramic interconnect technology", Microelectronics International, Vol. 20 No. 1. https://doi.org/10.1108/mi.2003.21820aab.001

“Top 10 developments” in ceramic interconnect technology

“Top 10 developments” in ceramic interconnect technology

Keywords: IMAPS, Ceramics

The latest advances and challenges – “The Top Ten Developments in Ceramic Interconnect Technology” – were recognized at a recent press event hosted by the Ceramic Interconnect Initiative (CII) at IMAPS 2002,the 35th Inter-national Symposium on Microelectronics in Denver, Colorado.

Nominations for the “Top Ten” were invited well in advance of the show, and from those nominations received, were chosen the winning top ten developments in ceramic interconnect technology. This was a global field including some very fine work that was evaluated by the CII Steering Committee, a globally recognized group of experts in ceramic interconnect technology.

The competition and the press roundtable were hosted by Mike Ehlert, a pioneer in the industry who has been particularly instrumental in the development of low temperature co-fired ceramics (LTCC).

The “Top Ten” winning companies are listed as follows:

1. 1.

   Heraeus Incorporated. Heraeus

2. 2.

   Cerel (Ceramic Technologies Ltd)

3. 3.

   CAD-Design Software

4. 4.

   Midcom-ESL

5. 5.

   Kyocera

6. 6.

   NEC

7. 7.

   SatconThere was no 8th place due to a three way tie for 9th place

8. 8.

   Phillips

9. 9.

   National Semiconductor’s “LMX9814 Blue Tooth Module in LTCC”

10. 10.

    Plextek. Plextek (England)