Keywords
Citation
(2002), "In-situ UV cure automates assembly of optoelectronic packages", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aad.006
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
In-situ UV cure automates assembly of optoelectronic packages
Keyword: Assembly
Palomar Technologies has designed and integrated a complete automated line for the production of optoelectronic packages. Depending on the package design and requirements, the line integrates the company's wire bonders with it's new In-situ UV Component Assembly Cell, which avoids problems inherent with “snap cure” methods such as out gassing, very small batch sizes, and short work times. (Plate 3)
Plate
3