International diary

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2002

38

Citation

(2002), "International diary", Microelectronics International, Vol. 19 No. 1. https://doi.org/10.1108/mi.2002.21819aac.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited


International diary

10–13 MarchReno, NVWebsite: www.imaps.org

CPCA 2002

12–14 MarchShanghai Yingzhan Business Service Co., Ltd.Tel: 0086-21-54904394, 54901782, 54901915Fax: 0086-21-54904537E-mail: yinzhanc@online.sh.cn,info@ying-zhan.comWeb site: http://www.ying-zhan.com

Electronic China

12–15 MarchPudong, ShanghaiOrganized by Messe Munchen InternationalContact: Thomas SchlittTel: +49 89 949 22119Fax: +49 89 949 22350schlitt@messe-muenchen.de

IPC Expo 2002

24–30 MarchLong Beach Convention Center, CA, USAIPCwww.ipcprintedcircuitexpo.org.

Nepcon Shangai

9–12 AprilShanghai Everbright Convention & Exhibition Centre, Shanghai, ChinaReed Exhibition Companies (REC) CCPIT Electronics & Information-Industry Sub CouncilTel: +(852) 28240330Fax: +(852) 28240178E-mail: shermen.ho@reedexpo.com.hkwww.nepconchina.com

EuroSimE 2002

3rd International Conference on Benefiting from Thermal and Mechanical Simulation in Microelectronics14–17 AprilParis, Francewww.eurosime.com

2002 International Conference on Electronics Packaging (ICEP) and 16th Microelectronics Show

17–19 AprilTokyo Ryutsu Center, Tokyo, JapanJIEPTel: +81-3-5310-2010 Fax: +81-3-5310-2011E Mail: imaps-j@jiep.or.jpWeb: http://www.jiep.or.jp/jiep/icep/index.html

Electronic Week 2002

24–26 AprilCOEX, Seoul, KoreaKyungyon Exhibition CorporationTel: +82 2 785 4771 Fax: +82 2 785 6117www.electronicweek.org

FiberComm

4–6 JuneMunich Messe, Munich, GermanyMesse München GmbHTel. (+ 49 89)949-20315Fax (+ 4989)949-20319E-mail: sixl@messe-muenchen.de

Nepcon East

10–12 JuneBayside Expo & Convention Center, Boston, MA, USATel: +1 203-840-5344Fax: +1 203-840-9344 www.nepcon.com/nepconeast/suggest.asp

European Microelectronics Packaging & Interconnection Symposium

16–18 JuneSofitel Hotel, Cracow, PolandSelim AchmatowiczTel.: +48 22 835 30 41 ext. 457Fax: +48 22 834 90 03E-mail: achmat_s@wa.onet.plhttp://www.itme.edu.pl/imaps.cracow2002/index.html

SMT/Hybrid/Packaging

18–20 JuneMessezentrum, Nürnberg, GermanyMesago GmbHTel: +49-711-61946-79Fax: +49-711-61946-93 www.mesago.de

Globaltronics

3–6 SeptemberSingapore ExpoReed Exhibition CompaniesTel: +65 434 3615 Fax: +65 334 2748Email: tracey.khoo@reedexpo.com.sgwww.globaltronics.com.sg

IMAPS USA

4–6 SeptemberColorado Convention Center, Denver, CO, USAIMAPSTel: +1 202 548 4001E-mail: imaps@imaps.orgWebsite: www.imaps.org

Nepcon UK

1–3 October 2002NEC Birmingham, Halls 1 & 2Reed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608www.nepcon.co.uk

EPC2002 – EuropeanPCB Convention& ECWC9 World Conference

October 8–10Koln Messe, Cologne, GermanyEIPC Services GmbHTel: +41 61 482 3900Fax: +41 61 482 3910E-mail: bborn@eipc.orgWebsite: http://www.eipc.org

Electronica 2002 – The 20th InternationalTrade Fair for Components & Assemblies in Electronics

November 12–15New Munich Trade Fair Centre, Munich, GermanyPress Officer: Angela PragTel: +49 89 949-20670Fax: +49 89 949-20679praeg@messe-muenchen.deWebsite: www.electronica.de

NEPCON WEST

December 4-6McCenery Convention Center, San Jose CA, USAPhone: 203-840-5689Fax: 203-840-9689Website: www.nepconwest.com

2003 Nepcon UK South

2–3 April 2003

Brighton Metropole, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608www.nepcon.co.uk

SMT/Hybrid/Packaging

6–8 MayMessezentrum, Nürnberg, GermanyMesago GmbHTel: +49-711-61946-79Fax: +49-711-61946-93www.mesago.de

Nepcon UK North

16–17 September 2003Harrogate International Centre, Harrogate, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608www.nepcon.co.uk

2004

Nepcon UK

October 2004NEC Birmingham, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608www.nepcon.co.uk

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