Keywords
Citation
(2001), "Microstamping and pump dispensing combined for ultra fine conductive epoxy dots", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aad.014
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Microstamping and pump dispensing combined for ultra fine conductive epoxy dots
Microstamping and pump dispensing combined for ultra fine conductive epoxy dots
Keywords: MRSI, Microstamping
MRSI has announced the introduction of combined microstamping with traditional positive displacement pump dispensing, for conductive epoxy dispensing in applications with very fine deposition, such as beam lead diodes (Plate 6).
Plate 6
Microstamping dispensing from MRSI
Ever-decreasing component geometry has necessitated the development of microstamping, which allows for conductive epoxy deposits down to 0.005. Additionally, the total volume of the deposit is greatly reduced by microstamping vs. dispensing due to a much smaller cross-section. The combination of microstamping with traditional pump dispensing offers the ability to accommodate these small sizes, as well as to maintain speed.
In process, the microstamping tool is placed into a rotating well of epoxy that is constantly leveled by a micrometer adjustable "Doctor blade". Once the epoxy is acquired, the system applies the material to the desired location on the substrate by lightly touching down with the compliant tip.
The system's two heads can be configured with either two positive displacement dispense pumps or one dispense pump head and one stamp head. The positive dispense pump can dispense accurate individual dots, lines and areas at production rates.
Further details: MRSI. Tel: +1 978-567-9449; Fax: +1 978-667-6109; http://www.mrsi.qroup.com