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Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Keywords: IMAPS, Conferences
Venue: The Novotel, Hammersmith, 1 Shortlands, London W6 8DR. Tel: +44 (0)20 8 237 7407; Fax: +44 (0)20 8 748 2228.
The UK chapter of the International Microelectronics And Packaging Society (IMAPS-UK) announces the return of its flagship European Technical and Commercial event MicroTech to be held at The Novotel Hammersmith, West London, on 28-31 January 2001. The event is co-sponsored by The European Union's EuroTraining project, as well as the IEE and the IEEE CPMT UK&RI Chapter.
Themed on "Compact modular microelectronics", the three days of conferences and exhibition will be preceded on day one by three intensive tutorials taught by eminent instructors in the field.
Day two covers "Advanced packaging" and continues the series of IMAPS' European Conference on MultiChip Modules and High Density Packaging.
Day three focuses on "Wireless technologies" covering aspects of ceramics and laminate materials as well as circuits and systems requiring modular microelectronics.
Day four will deliver latest papers on "Microsystems packaging" dealing with the challenges in this field of growing global importance.
Throughout the three conference days there will be a Trade Exhibition supporting the Conference that will include organisations representing important sectors of the electronics industry relevant to packaging, interconnection and microsystems.
Sunday, 28 January 2001
Three intensive tutorials are provided from the portfolio of the EC Euro Training Awareness and Advanced Thematic courses (see Euro Training services at: http://www.eurotraining.net)
Code Division Multiple Access (CDMA) and MCM Technologies in 3rd Generation Mobile Communications
Instructed by Dr Charles Free, Communications Research Group, UK.
The evolution of mobile telephony is assisted by the continuing development of compact phones, which requires increasingly high density hardware technologies such as multichip modules (MCMs), stub antennae and efficient digital coding techniques. This tutorial provides an overview of the technology related to the use of MCMs for compact telephony. Current practices for system planning and signalling strategies are also described. The relative merits of CDMA and GSM technologies are compared and their influence on the development of existing systems and predicted solutions for the future are discussed.
Encapsulation and Underfill for Advanced Packaging
Instructed by Martin Bartholomew, UK.
This tutorial is a one-day intensive professional development course covering the important modern topics of plastic encapsulation of semiconductor devices and underfilling with fluid polymers applied to flip-chips and ball-grid-array (BGA) packaged devices.
Microsystems and MEMS for Industry and Environment
Instructed by Dr Malcolm Wilkinson, TFI, UK.
Active sensor device miniaturisation using Microsystems Technology (MST) – more traditionally known as micro-electro-mechanical systems (MEMS) in the USA and Japan – is a disruptive technology which will impact industrial and environmental applications and change businesses. This tutorial for industry will give you information to help make critical decisions on products and business strategies. The tutorial will benefit MST/MEMS users in industrial and environmental sectors. The contents include a scene-setting background on development history, followed by the economics of developing and incorporating MST/MEMS into marketable products. Insight is given into the global markets for MST/MEMS and into marketing strategies. The technologies, innovations and markets are examined for environmental, industrial, security and health and safety applications, together with useful case studies to give the attendees an awareness of actual products.
Monday 29 January 2001
7th European Conference on High Density Packaging10.00-11.00 Registration, coffee/tea and croissants and exhibition.11.00-11.30 Encapsulation of Large Densely Populated Die with Small Gap Horatio Quinones, Asymtek, USA.11.30-12.00 Bare Die Imager Ian Thompson-Bell, The Technology Partnership plc, Melbourn, UK.12.00-12.30 Exhibitor presentations.12.30-14.00 Lunch and exhibition.14.00-15.00 The Effect of Thermal Field on the Nonlinear Dynamical Response of a Printed Wiring Board Xiaoling He, Robert Fulton, Georgia Tech, USA.14.30-15.00 Advances in Interconnection Technology Using Selective Electroplating Peter Moran, Advanced Interconnection Technology Ltd, Manchester, UK.15.00-15.45 Coffee/tea and exhibition15.45-16.15 Investigations of Assembly Properties of Conductive Layers in LTCC Circuits A. Bochenek, B. Bober, A. Dziedzic, L. Golonka, Institute of Microsystem Technology, Wroclaw University of Technology, Poland.16.15-16.45 Diffusion Patterning Technology and Materials for Thick Film Ceramic MCMs Marko Hrovat, Darko Belavic, Marko Pavlin, Jozef Stefan Institute and HIPOT, Slovenia.
Tuesday 30 January 2001
European Conference on Wireless Technologies08.45-09.15 Registration, coffee/tea and croissants and exhibition.09.15-09.45 High Performance Packaging for Wireless Prof. David Pedder, Intarsia, UK.09.45-10.15 Low Cost RF and Microwave Components in LTCC Liam Devlin and Graham Pearson, Plextek, UK and Bob Hunt, C-MAC, UK.10.15-11.00 Coffee/tea and exhibition.11.00-11.30 Micro Technology Measurement Techniques for the Evaluation of Thick Film Materials Used in Wireless Applications Zhengrong Tian and Charles Free, Middlesex University, UK.11.30-12.00 Narrow Bandwidth, High Frequency, Band-pass Filter Using Thin Film and Photo-imageable Thick Film Technology K.J. Williams and P. Barrett, Kingston University, UK, P. Scott, Racal Defence Ltd and J. Ferguson, Du Pont, UK.12.00-14.00 Lunch and exhibition14.00-14.30 LTCC Systems for Low GHz Frequencies – a Study of the Critical Properties and Their Measurement Techniques Peter Barnwell, Quentin Reynolds, Heraeus Circuit Materials Division, USA and UK.14.30 - 15.00 Microwave/Milimetrewave Packages Colin Holmes, Kyocera.15.00-15.45 Coffee/tea and exhibition.15.45-16.15 Reliability Testing of Mobile Phones Circuit Boards Daya Perera, Nokia Mobile Phones Research, UK.16.15-16.45 Wireless Packaging Don Brown, IWPC, USA, by telelink from USA.
Wednesday 31 January 2001
2nd European Conference on Microsystems Packaging 200108.45-09.15 Registration, coffee/tea and croissants and exhibition.09.15-09.45 Current Development of Ultrathin RFID Systems R. Leutenbauer et al., Fraunhofer IZM, Berlin, Germany.09.45-10.15 Modular Integrated Microsystems G. Williams, K. Bouris, D. Barrow, P. Ivey, L. Seed, P. Burgess, J. Cefai, D. Lowrie, P. Myers, University of Sheffield, University of Cardiff, Promatech Ltd, MSTB Ltd, Multicore Solders Ltd, X-TEC Ltd, UK.10.15-11.45 Coffee/tea and exhibition.11.00-11.30 Moulded Interconnect Device- Solutions for 3D Compact Packaging Takeshi Okamoto, Matsushita Electric Works, Germany.11.30-12.00 Anodic Bonding: A Wafer Scale Packaging Technique for MEMS and Microelectronic Devices Jan Kowal, Applied Microengineering Ltd, Oxford, UK.12.00-14.00 Lunch and exhibition.14.00-14.30 A Review of Production Packaging for Microfluidic Devices J.M. Wilkinson and N. Sinnadurai, TFI, Cambridge, UK.14.30-15.00 SU8 (Photolithography for 3D Structures) Technology for Microfluidic Devices J.A. Iderman et al., NMRC, Cork, Ireland.15.00-15.45 Coffee/tea and exhibition.15.45-16.15 Silicon Motherboards for Photonic Device Assembly and Packaging Jochen Kuhmann, Hymite Ltd, Copenhagen.16.15-16.45 Flexible Interconnect for Biological Microsystems Assembly Andeas Schneider, Fraunhofer IBMT, St Ingbert, Germany.
For further information, please contact: IMAPS UK Secretariat, 63 Coachmans Lane, Baldock, Herts SG7 5BG, UK. Tel: +44 (0) 1462 896733; Fax: +44 (0) 1462 896567, E-mail: Office@imaps.org.uk