MRSI-505 combines flip chip bonding and delicate GaAs handling

Citation

(2000), "MRSI-505 combines flip chip bonding and delicate GaAs handling", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cad.004

MRSI-505 combines flip chip bonding and delicate GaAs handling

MRSI-505 combines flip chip bonding and delicate GaAs handling

Keywords MRSI, Flip chip, Assembly, Microelectronic modules

MRSI has developed an innovative process combining delicate GaAs handling and flip chip bonding for microwave module production with the MRSI 505 Assembly Work Cell (Plate 1). MRSI developed this process while working with a number of industry leading customers who have been seeking to utilize flip chip technology in microwave module production, since this technology boosts product quality and cuts production time by allowing for increased frequency and at the same time reducing required RF tuning.

Plate 1 The MRSI 505 Assembly Work Cell

For the process of thermal compression flip chip bonding, the MRSI-505 orients the die utilizing an upward-facing camera with integrated vision and application-specific lighting and optics. The die is then placed to a programmable controlled contact force. The system supports a broad range of forces and is able to be accurate over the entire range.

The MRSI 505, an advanced microelectronic assembly system, has become the recognized industry standard for ultra-precision assembly for microwave, RF and optical module manufacturing. It offers features that include high accuracy placement ±12µm, 360° random die orientation, substrate alignment (global and local), programmable controlled force, delicate part handling including GaAs devices, automatic tip changing, cassette to cassette handling, waffle packs, gel packs, tape feeder, wafer pick-up, and more.

For more information, contact: MRSI at 101 Billerica Avenue, Building 3, N. Billerica, MA 01862-1256. Tel: 978 667 9449; Fax: 978 667 6109; Web site: www.MRSIgroup.com