Keywords
Citation
(2000), "IMAPS Nordic", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bab.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
IMAPS Nordic
Keywords IMAPS, Denmark, Conferences
The IMAPS Nordic 37th Annual ConferenceCall for abstracts
Marienlyst Hotel, Helsingør, Denmark, 10-13 September 2000
You are invited to submit an abstract to the 37th Annual Conference.
The abstract must be non-commercial and submitted in electronic form to the IMAPS Nordic Conference (conference@imapsnordic.a.se) no later than 20 April 2000. Speakers will be notified of paper acceptance by e-mail 20 May 2000. The deadline for the final paper is 20 July 2000.
Proposed topics include:
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microelectronics applications;
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trends in telecommunications;
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ceramics for future electronics;
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using unique materials;
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manufacturing processes;
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high frequency packaging;
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bare die, MCM and 3D packaging;
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BGAs in real life production;
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CSP and flip chip;
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environmentally sound electronics;
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3-D moulded interconnect devices;
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advanced interconnect, encapsulation;
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EU ban of Pb and halogens;
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future electronics, strategies and R&D;
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MEMS, micro electro mechanical systems.
For the latest information about the Conference and the Exhibition, visit our homepage at http://www.imapsnordic.a.se or e-mail the Exhibitor Host at exhib@imapsnordic.a.se
IMAPS Nordic, PO Box 277, SE-431 24 Mölndal, Sweden. Fax: +46 19 56 7070, info@imapsnordic.a.se; http://www.imapsnordic.a.se