Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities

Citation

(2000), "Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.009

Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities

Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities

Keywords: Quad Systems, Electronics packaging

Quad Systems Corporation launched the Quad APS-1H™ hybrid module advanced packaging system at IMAPS'pp (Plate 5). Quad APS-lH features include: Selectable alignment method - Pick Preview; QuadAlign™, or upward vision. APS-1H users maximize productivity by selecting the alignment method for each component or die.

Plate 5The Qyad APS-1H™

Pick Preview identifies the die's position and orientation in the presentation media - usually waffle packs or GEL-PAKs®. Pick Preview enables the APS-lH to pick die on-centre from oversized waffle pack cells. The centred pickup tool applies balanced force across the component, resulting in uniform bondline thickness. Pick Preview employs user-selected die features to accurately place the die in reference to the bond pads. This method claims to be more accurate than edge alignment due to dicing tolerances. Accurate bond pad alignment maintains consistent wire geometry and optimizes critical RF assembly performance.

QuadAlign, a patented horizontal imaging system attached to the head, speeds the operation of the APS-1H when placing passive or other repeatable, tape-fed components. QuadAlign picks a component from a pre-taught location and aligns it on-the-fly, saving operation time by eliminating a third step required for Pick Preview or vision alignment. QuadAlign offers the highest productivity in addition to accurate die location process capability for chip and wire assembly processes where Pick Preview or vision alignment is not required. With its high magnification, QuadAlign reportedly processes even the smallest diodes with ease.

The APS-lH's upward vision alignment provides flip chip and BGA bump inspection in addition to lead inspection for SMT devices.

The programmable placement force for process control feature protects fragile die and allows users to adjust placement force and duration for each die type. This vital process control assures high product quality and reliability.

The APS-lH's large tabletop area accepts up to 108 two-inch waffle packs or custom tooling to minimize setup and changeover time and maximize productivity. The in-line conveyor's fixed rail position enables greater access to waffle packs from the front of the machine to aid hybrid manufacturers' use of multiple die types.