MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000

Keywords

Citation

(2000), "MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.002

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation

MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation

Keywords: MicroJoin, Hot bar

MicroJoin, Inc. has announced immediate availability of its Model 2000 Pulsed Heat Hot Bar Bonder System, which integrates in one system the critical features and functions needed for soldering, heat seal or ACF bonding (Plate 1). The Model 2000 brings together a state-of-the-art temperature controller, a wide selection of ceramic hot bar thermodes, precision part positioning/alignment mechanisms, high accuracy Z-axis hot bar actuator and a microprocessor controlled user interface that make the system a suitable choice for dedicated high-throughput hot bar applications.

Plate 1Microjoin's model 2000 workstation

Designed for cost-effective deployment within throughput-driven production operations, the Model 2000 is a single-head bench-top system, controlled by a built-in microprocessor. The system's TC 1200 Temperature Controller provides power for rapid heating, combined with precise closed-loop control to minimize overshoot and to maintain fast, sustained cycle times. The Model 2000 uses MicroJoin's patented Ceramic Hot Bar Technologyý (CHBT). Unlike conventional metal hot bars, CHBT provides exceptional flatness under dynamic thermal conditions, isolates parts from electrical overstress, has an oxide-free working surface for consistent heat conduction, and minimizes temperature gradients across the working face of the hot bar.

Overall deployment flexibility and process optimization are further enhanced by the Model 2000's modular expandable design, the ability to locally store up to ten bonding profiles in non-volatile RAM, and built-in quick-change capabilities for attaching different sizes of hot bars. In addition, a variety of options, such as different X-Y and rotary positioning stages, visual alignment aids, and auto flux dispensing, enable the manufacturer to cost-effectively tailor the Model 2000 configuration to almost any specific application, such as ribbon cables, flex connectors, TAB to board, heat seal connectors, etc.

For further details contact: Kathleen Prestera, Marketing Communications Specialist. Tel: +1 (858) 877-2100; E-mail: communications@microjoin.com