Y2K, here we are!

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000

Citation

Nihal Sinnadurai, P. (2000), "Y2K, here we are!", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aaa.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Y2K, here we are!

Y2K, here we are!

The anxiously, even apprehensively, awaited Y2K is now. And we are alive and about to form the foundations for the next generations of occupants of this still green Earth. Will we discharge our obligations responsibly or selfishly?

The last decade of the second millennium showed significant responsibility emerging in the European Union towards "Green" issues which impact on electronics as well as other walks of life. "Take back" legislation (lifetime ownership by manufacturers) and moves towards diminishing the use of harmful materials and pollution arising from manufacturing waste are being drafted. The proposal on Waste Electrical and Electronic Equipment (WEEE) will be firmed up. Our responsibility, as temporary custodians of the Earth, is to work proactively to ensure we minimise damage without impeding evolution and change. We need to remind ourselves that extinction (of bio-diversity and endangered species) is forever. IMAPS continues to be in the forefront to provide a platform to air such issues. Indeed Green (environmentally friendly) Electronics was a strong focus of the 12th European Microelectronics Conference held at Harrogate in June 1999.

This first year of the millennium will see two major pan-European Microelectronics events organised by IMAPS:

The first is "MicroTechnology 2000" which takes the slot in 23-25 January 2000 at the London Hammersmith Novotel, and kicks off with a one-day Tutorial "Building MCMS with CSPs and Organic HDI Boards" on 23 January. The two following Conference days are on two important Microelectronics topics offering delegates from the electronics industry the opportunity to hear outstanding papers presented by leading international speakers:

  1. 1.

    Day one will be IMAP's 6th European Conference on MultiChip Modules (EC-MCM2000), with papers from the USA, Slovenia, Switzerland, Italy, Germany and the UK.

  2. 2.

    Day two will focus on Microsystems Packaging with papers from Ireland, the USA, the UK, France, The Netherlands and Germany.

A significant Table-Top exhibition will accompany the Conferences. This will be one of the largest Conferences held in the UK covering the Microtechnology industry. It will be truly international in its scope, with 23 papers being presented over the two days. Expert speakers will be representing leading companies, research centres and universities from the UK, Ireland, France, Germany, The Netherlands, Italy, Switzerland, Slovenia and the USA. In this new millennium, now is the time to present and discuss the future of the Microtechnology industry and its role in the future of electronics. Find out more at the IMAPS Web sites at http://imaps.org.uk

The second event is the "Microelectronics Packaging Symposium Prague-2000" being held in the magnificent city of Prague during 18-20 June. The event promises to have a great technical programme with contributions from East and West, North and South. Visiting the Symposium Web site is a must at http://K313.feld.cvut.cz/micro If you haven't visited Prague, then plan to benefit from the Conference opportunity also to see this beautiful city, which is a wonderful surprise as you explore its various locations, fortunately not damaged by the invaders or restored where it was.

Prof. Nihal SinnaduraiIMAPS-UK