Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices

Citation

(1999), "Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.016

Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices

Dexter introduces Hysol^® FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices

Keywords Dexter, Encapsulation, Encapsulant materials

Dexter Electronic Materials introduces Hysol FluxFill 2000. This new, high performance material is designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. Hysol FluxFill 2000, formulated to provide the required flux for solder joint formation, delivers the necessary environmental protection and stress distribution properties required by advanced assembly and packaging applications. Its fully developed properties are established by using a dispense, place and standard surface mount technology reflow cycle of approximately three minutes with no post cure requirements.

Compared to conventional underfill processing, manufacturers using Hysol FluxFill 2000 can decrease cost-of-use through the elimination of separate flux application and oven cure steps. This provides a corresponding reduction in process cycle time, capital equipment investment and floor space requirements.

Hysol FluxFill 2000 is compatible with a variety of device passivations, interconnect substrates and substrate finishes including organic solder preservatives (OSP) and copper-nickel-gold.