Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999

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Keywords

Citation

(1999), "Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bad.005

Publisher

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Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology

Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology

Keywords Lithography, Silicon Valley Group

Building on the success of previous generations of step-and-scan lithography systems, Silicon Valley Group has unveiled the semiconductor industry's first production-worthy 193nm step-and-scan lithography system. At the same time, the company also introduced an aggressive lithography roadmap outlining comprehensive solutions for 157nm and extreme ultraviolet lithography (EUV) that many expect will enable unparalleled advances in this critical chip technology well into the next century.

The announcement comes at a time when leading industry chipmakers and semiconductor equipment suppliers are questioning which lithography technology to adopt for future generations of chip manufacturing. This is being necessitated by limitations in current lithographic manufacturing processes and driven largely by the demand for new, faster, smaller and more powerful electronics applications.

Coupled with its advanced capabilities, the movement to DUV lithography, a more advanced technology than traditional i-line methods currently in use, is expected to propel SVG to the forefront.

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