BULK IMAGE EFFECTS OF PHOTORESIST IN THREE‐DIMENSIONAL PROFILE SIMULATION
ISSN: 0332-1649
Article publication date: 1 April 1991
Abstract
3D bulk image effects in high‐NA lens lithography are studied through 3D exposure and development simulations by applying a Mack model to the 3D exposure process.
Citation
ISHIZUKA, T. (1991), "BULK IMAGE EFFECTS OF PHOTORESIST IN THREE‐DIMENSIONAL PROFILE SIMULATION", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 10 No. 4, pp. 389-400. https://doi.org/10.1108/eb051715
Publisher
:MCB UP Ltd
Copyright © 1991, MCB UP Limited