Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications
P. Baumbach
(ESL Europe/Agmet Ltd, Reading, Berkshire, England)
M. Bilinski
(ESL Europe/Agmet Ltd, Reading, Berkshire, England)
J. Whitmarsh
(ESL Europe/Agmet Ltd, Reading, Berkshire, England)
J. Lorenz
(Electro-Science Laboratories, Inc., Portland, Oregon, USA)
P. Bless
(Electro-Science Laboratories, Inc., Portland, Oregon, USA)
M.A. Stein
(Electro-Science Laboratories, Inc., Portland, Oregon, USA)
25
Citation
Baumbach, P., Bilinski, M., Whitmarsh, J., Lorenz, J., Bless, P. and Stein, M.A. (1995), "Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications", Microelectronics International, Vol. 12 No. 2, pp. 18-21. https://doi.org/10.1108/eb044559
Publisher
:Emerald Group Publishing Limited
Copyright © 1995, Emerald Group Publishing Limited