Quality Issues in Chip‐on‐board (COB) Technology
E. Giani
(CompAS Electronics Inc., Epitek Microelectronics Division, Kanata, Ontario, Canada)
J.P. Mathurin
(CompAS Electronics Inc., Epitek Microelectronics Division, Kanata, Ontario, Canada)
Abstract
Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.
Citation
Giani, E. and Mathurin, J.P. (1994), "Quality Issues in Chip‐on‐board (COB) Technology", Microelectronics International, Vol. 11 No. 2, pp. 5-10. https://doi.org/10.1108/eb044525
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:MCB UP Ltd
Copyright © 1994, MCB UP Limited
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