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Solderability Testing in Hybrid Technology

R.A.L. Vanden Berghe (Hybrid Division, Alcatel‐Bell, Gent, Belgium)
B. Willems (Hybrid Division, Alcatel‐Bell, Gent, Belgium)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1992

Abstract

The solderability of a material is considered as the ability of the surface to be wetted by solder, and the rate at which this process occurs. The solderability of thick film conductors based on palladium—silver, by Pb/Sn/Ag solder, was evaluated using a meniscograph. The influence of the composition of the conductor and that of the temperature of the solderbath on the solderability were measured. The usefulness of meniscographic data for the production line is indicated by showing the relation between the production data, reported as the rate at which a full automated solder machine is operated, and the meniscographic results.

Citation

Vanden Berghe, R.A.L. and Willems, B. (1992), "Solderability Testing in Hybrid Technology", Microelectronics International, Vol. 9 No. 3, pp. 52-60. https://doi.org/10.1108/eb044480

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited