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Hybrid (and Multi‐chip Module) Design on the IBM‐PC Platform

T. Corless (Central Research Laboratories Ltd, Dawley Road, Hayes, Middlesex, England)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1992

Abstract

The increased power and the memory available on IBM‐PC and compatible computers have led to the emergence of a wide range of engineering software. The large number of PCs offers an attractive market, with the result that software costs tend to be lower than those of similar packages on workstations. It is the purpose of this paper to describe an implementation of a hybrid/multi‐chip module design system, which runs on IBM‐PC compatible hardware.

Citation

Corless, T. (1992), "Hybrid (and Multi‐chip Module) Design on the IBM‐PC Platform", Microelectronics International, Vol. 9 No. 3, pp. 19-24. https://doi.org/10.1108/eb044477

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited