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Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors

M. Plötner (Dresden University of Technology, Institute of Semiconductor and Microsystem Technology, Dresden, Germany)
G. Sadowski (Dresden University of Technology, Institute of Semiconductor and Microsystem Technology, Dresden, Germany)
S. Rzepka (Dresden University of Technology, Institute of Semiconductor and Microsystem Technology, Dresden, Germany)
G. Blasek (Dresden University of Technology, Institute of Semiconductor and Microsystem Technology, Dresden, Germany)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1991

Abstract

Indium solders are frequently used for interconnections in cooled systems because of their high ductility down to very low temperatures. Very fine contact pitches are required for hybrid mosaic radiation sensors compared with those for conventional flip‐chip technology. This paper presents solutions for bumping and bonding indium bumps based on the measured properties of indium solders in relation to the requirements of, and possibilities for, manufacture of fine pitch solder bump features.

Citation

Plötner, M., Sadowski, G., Rzepka, S. and Blasek, G. (1991), "Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors", Microelectronics International, Vol. 8 No. 2, pp. 27-30. https://doi.org/10.1108/eb044447

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited