The increasing complexity of hybrid circuits has led to a need for a reliable multilayer system. As well as reliability, the manufacturer will, of course, also attach considerable importance to material and production costs. Until now, thick film multilayer applications have been limited by the inability of existing technology to reduce their susceptibility to galvanic effects occurring between individual conductive layers during fabrication. Now, however, this company has developed a multilayer dielectric which prevents metal migration. The system is supported by conductor and resistor systems.
Gilles, T., Reynolds, Q. and Steinberg, J. (1990), "A New Generation Multilayer System: Low Cost and High Reliability", Microelectronics International, Vol. 7 No. 1, pp. 24-27. https://doi.org/10.1108/eb044398Download as .RIS
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