Packaging for Thermal Detectors

Abstract

A new lass of sensors for thermal imaging and detection in the infra‐red band is emerging which exploits the pyroelectric effect in ferroelectric materials. These sensors, which are fabricated in the form of large linear or two‐dimensional arrays of detectors interfaced to a silicon readout circuit, do not require cooling for their operation, in contrast to the photon detection based thermal imagers. They thus have the potential for low cost thermal detection and imaging. This paper examines the design of these arrays and the technologies employed in their fabrication, with particular attention to their specialised packaging requirements, by reference to a range of linear and two‐dimensional pyroelectric array devices that have been fabricated in this laboratory.

Citation

Robinson, M.K., Shorrocks, N.M., Bicknell, R.W., Watson, P. and Pedder, D.J. (1989), "Packaging for Thermal Detectors", Microelectronics International, Vol. 6 No. 1, pp. 25-28. https://doi.org/10.1108/eb044354