Present State of Directly Solderable Copper PTF
Article publication date: 1 February 1988
This paper describes a newly developed Copper PTF (Polymer Thick Film) which is characterised by direct solderability and high electrical conductivity. This Copper PTF claims to solve various problems existing in the conventional subtractive or firing process. It also realises new circuit production processes which are difficult to attain if conventional methods are applied.
Tsunaga, M. and Kato, S. (1988), "Present State of Directly Solderable Copper PTF", Microelectronics International, Vol. 5 No. 2, pp. 32-35. https://doi.org/10.1108/eb044322
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