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Integration of Polymer Thick Films with PCB Technology in the Telecommunication Field

G. Castelli (Telettra SpA, Vimercate, Italy)
G. Lovati (Telettra SpA, Vimercate, Italy)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1987



The paper describes the results obtained by the integration of Polymer Thick Film and Printed Circuit Technologies. Polymer Thick Film (PTF) Technology, applied to PCB manufacturing, helps the designer's task considerably and offers an interesting way to achieve time and cost reduction. The use of conductive and dielectric materials to generate cross‐overs and low interconnection density multilayers on epoxy‐glass substrates is shown and basic design rules are discussed. The performances of PTF conductive materials from two different suppliers are investigated in terms of conductivity, current carrying capacity and contact resistance with the copper‐clad layer. Surface and bulk insulation resistance, capacitance, loss factor and breakdown voltage are studied for dielectric materials from two different suppliers. The effects of environmental tests, i.e., thermal shocks, high temperature storage and temperature‐humidity‐bias test, on the performances of dielectric and conductive PTF are investigated by means of suitable test patterns. Application examples of Transmission System boards are discussed in terms of design and manufacturing times and costs.


Castelli, G. and Lovati, G. (1987), "Integration of Polymer Thick Films with PCB Technology in the Telecommunication Field", Microelectronics International, Vol. 4 No. 3, pp. 42-48.




Copyright © 1987, MCB UP Limited

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