Measurement of the Tackiness of Solder Pastes
Article publication date: 1 March 1986
Arising from discussions at the International Institute of Welding Solder Paste Committee, the influences of a number of testing variables on the tack strength of solder pastes have been examined using the load cell system on a Meniscograph Solderability Tester. As a result, a standard method of testing has been proposed.
Ainsworth, P.A. (1986), "Measurement of the Tackiness of Solder Pastes", Microelectronics International, Vol. 3 No. 3, pp. 27-29. https://doi.org/10.1108/eb044245
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