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Measurement of the Tackiness of Solder Pastes

P.A. Ainsworth (Fry's Metals Ltd, Merton Abbey, London, England)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1986

23

Abstract

Arising from discussions at the International Institute of Welding Solder Paste Committee, the influences of a number of testing variables on the tack strength of solder pastes have been examined using the load cell system on a Meniscograph Solderability Tester. As a result, a standard method of testing has been proposed.

Citation

Ainsworth, P.A. (1986), "Measurement of the Tackiness of Solder Pastes", Microelectronics International, Vol. 3 No. 3, pp. 27-29. https://doi.org/10.1108/eb044245

Publisher

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MCB UP Ltd

Copyright © 1986, MCB UP Limited

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