Resistor Chips for Thick Film Hybrids
H. Diletti
(Balzers AG, Balzers, Liechtenstein)
R. Hoffmann
(Balzers AG, Balzers, Liechtenstein)
G. Sele
(Balzers AG, Balzers, Liechtenstein)
J. Rees
(Balzers High Vacuum Ltd, Berkhamsted, England)
21
Abstract
Applications for thin film resistor chips in thick film hybrid circuits are discussed in relation to the different technologies involved, namely naked and encapsulated forms of mounting.
Citation
Diletti, H., Hoffmann, R., Sele, G. and Rees, J. (1985), "Resistor Chips for Thick Film Hybrids", Microelectronics International, Vol. 2 No. 2, pp. 18-19. https://doi.org/10.1108/eb044171
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited