Editorial

Abstract

Interconnection, packaging and mounting of electronic devices tend to be too often neglected in development of the increasingly sophisticated devices of today. Whilst the electronics sector is probably the most innovative of all manufacturing industries and has an excellent record in the production of miniature devices of increasing complexity and capability, development of reliable, efficient joining techniques, essential for manufacture of marketable systems, is too often considered to be a secondary activity. Recommendations for interconnection and packaging techniques are frequently demanded towards the end of a costly development programme, at a stage when device design has been decided and when it is too late to make modifications which would facilitate these joining operations.

Citation

Johnson, K. and Waterfield, B. (1985), "Editorial", Microelectronics International, Vol. 2 No. 2, pp. 2-4. https://doi.org/10.1108/eb044167