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Flexible In‐Line Robotic Microelectronic Assembly System: Universal Instruments Corporation, Binghamton, New York

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1984

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Abstract

The RHyMAS® In‐Line Robotic Hybrid Microelectronic Assembly System is a high volume, high speed component placement and verification system. It is capable of automatically loading substrates from feed mechanisms onto a transfer mechanism, precisely positioning a wide variety of components onto the substrates, and automatically unloading populated substrates to follow‐on operations.

Citation

(1984), "Flexible In‐Line Robotic Microelectronic Assembly System: Universal Instruments Corporation, Binghamton, New York", Microelectronics International, Vol. 1 No. 4, pp. 70-70. https://doi.org/10.1108/eb044148

Publisher

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MCB UP Ltd

Copyright © 1984, MCB UP Limited

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