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Processing Polymer Thick Film Circuitry with Radiation Curing

W.J. Green (Methode Development Company, Chicago, Illinois, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 February 1983



Polymer thick film, as an additive process for making circuitry, is not new but has recently received considerable attention. The process has a number of attractive features to offer and when radiation curing is used to accelerate the curing process the technology becomes even more attractive. To be accepted by industry on a large scale, however, these materials must be certified by independent circuit board testing laboratories. Using infra‐red as the curing process, Methode prepared a polymer thick film version of a test pattern used for testing to Mil 55110 and produced some very promising results.


Green, W.J. (1983), "Processing Polymer Thick Film Circuitry with Radiation Curing", Microelectronics International, Vol. 1 No. 2, pp. 12-13.




Copyright © 1983, MCB UP Limited

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