Examination of Various Soldered Surfaces and Electronic Components by Confocal Microscopy

Abstract

The unique advantages of confocal microscopy are used to explore four cases of interest: (i) voids in solder (depth and surface texture determined), (ii) steam vs ambient aged solder coupons (significant differences detected), (iii) integrated circuit construction (sub‐surface contamination by µm‐size particles observed) and (iv) circuit boards and solder pads (non‐destructive optical sectioning through no‐wash flux layers). It is shown that confocal microscopy strongly complements SEM (scanning electron microscopy); SEM alone presents an incomplete description of a solder surface and in fact can sometimes produce misleading results.

Citation

Braterman, P.S., Marshall, J.L., Sees, J., Tan, C. and Zhao, J. (1995), "Examination of Various Soldered Surfaces and Electronic Components by Confocal Microscopy", Soldering & Surface Mount Technology, Vol. 7 No. 2, pp. 22-26. https://doi.org/10.1108/eb037895