Study of the Corrosivity of Solder Pastes
Abstract
The corrosive power of solder pastes is studied by implementing a new method compatible with the common rules of use. The entire methodology is fully described. The results show evidence of corrosion with some solder pastes that have been identified by microscopic and EDX analysis. The corrosion mechanism is ‘mouse bite’ and conductive anodic filaments. A ranking of the different solder pastes tested is given and pass criteria for this new method of evaluation are proposed.
Citation
Guinet, J., Lambert, X. and Bono, D. (1994), "Study of the Corrosivity of Solder Pastes", Soldering & Surface Mount Technology, Vol. 6 No. 1, pp. 11-14. https://doi.org/10.1108/eb037849
Publisher
:MCB UP Ltd
Copyright © 1994, MCB UP Limited