SM Placement Technology: Part 1
H. Pawlischek
(Siemens, Munich, Germany)
38
Abstract
This paper, which will be published in two parts in consecutive issues of Soldering & Surface Mount Technology, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit Technology: New Processes, New Technologies’, edited by G. Herrmann and K. Egerer and published by Electrochemical Publications Ltd, Port Erin, Isle of Man.
Citation
Pawlischek, H. (1993), "SM Placement Technology: Part 1", Soldering & Surface Mount Technology, Vol. 5 No. 2, pp. 53-59. https://doi.org/10.1108/eb037827
Publisher
:MCB UP Ltd
Copyright © 1993, MCB UP Limited